S Series 3D-AOI
Dimple depth in μm — judged OK/NG by threshold, not by guess
2D sees grey-level anomalies but cannot give true depth. The S Series 3D extension turns “how deep is the dimple” into a configurable threshold: three levels L1 / L2 / L3, 2D and 3D views side by side, data straight into MES / SPC.
Three 3D levels
| Level | Approach | Suited for | Output |
|---|---|---|---|
| L1 | Calibrated 2D | Standard lines — presence/absence first | 2D verdict + calibration reference |
| L2 | Full 2D scan + 3D review | IC substrate / HDI dimple inspection | μm-level depth + OK/NG by threshold |
| L3 | Full 3D inspection | High-end substrate full inspection (planned) | Whole-board 3D topography |
3D at work
Why true depth matters
- Dimple criteria are moving from “is there a dimple” to “how many μm” — customers specify the number
- Hole-bottom residue and uneven plating show little grey-level difference; 2D struggles to judge reliably
- 3D depth data is archivable and traceable, supporting MES / SPC and pre-packaging release decisions
Relation to the S Series platform
3D is an option on the S Series platform: same machine, same data flow and AI pipeline — add the 3D module when needed, no separate tool required.
Contact us for details ｜ Tel: +86 025-52396180