S Series Substrate AOI
The precision ladder from 1 mil to 0.39 mil — blind via & laser via inspection × full-process AI
Advanced packaging pushes substrate line width into the sub-mil range (AI chip CoWoS substrates 12L+ / 0.6 mil, 5G optical modules 0.5–0.8 mil, Micro-LED substrates 0.5–0.8 mil). Traditional 1 mil accuracy is no longer enough. The S Series Substrate AOI covers the whole range from rigid boards to IC substrates on one precision ladder — stopping escape defects before packaging.
Precision ladder
| Model | Line width | Pixel resolution | Coverage | Status |
|---|---|---|---|---|
| S9C | 1.2 mil class | 5 μm/px | General purpose: inner/outer layers, P0.9 LED boards, rigid-flex steps, secondary copper, transparent substrates | In production |
| S11C | 1.0 mil / 25.4 μm | 8 μm/px | Rigid boards / HDI / standard substrates | In production |
| S13C ★ | 0.6 mil / 15.24 μm | 5 μm/px | High-end IC substrate (ABF/BT) / Micro-LED driver boards | In production |
| S15C | 0.47 mil / 12 μm | ≈3 μm/px | ABF/BT high-end substrate / HDI any-layer / Mini-LED boards | Prototype done |
Per the 3-pixel-per-line rule: reliable minimum line width ≈ 3 × pixel resolution. S17 (0.39 mil / 10 μm) is planned.
Inspection principle: point-by-point comparison of design data vs. captured image
- Scan & image — colour line scan, multiple images, bright/dark field
- Feature extraction — conductors and holes from grey level and gradient
- Auto registration — CAM ↔ image coordinates, tolerating placement deviation (±80 mil / ±2.5°)
- Defect judging — quantitative evaluation of opens/shorts, thin lines, hole defects
- Classify & review — classification, review, statistics; results feed back to AI
Inspection capability
Materials: FR-4 rigid / FPC / rigid-flex / dry-film plated / HDI / IC substrate (ABF, BT) / Micro-LED / ceramic and transparent substrates
Defect types: short·open / bump·nick / residue·pinhole / missing·extra hole / broken·offset hole / thin line·narrow spacing / dimple · hole-bottom residue (mandatory for IC substrate / HDI)
Hole inspection: through / VIA / blind / laser vias
- Through / component holes (200 μm+): missing, extra, broken
- VIA / blind vias (75–150 μm): missing, offset, diameter — MARK registration success ≥99% (repeat clamping/scan verified)
- Micro vias (25–75 μm): laser drilling inspection, needs sub-mil class machine
- Laser vias: before plating (after desmear) and after plating (dimple) stages
Hole position and diameter accuracy supported by system calibration (0.5 μm class) and sub-pixel measurement.
3D options
2D sees grey anomalies but cannot give true depth. S Series supports L1 (calibrated 2D) or L2 (full 2D scan + 3D review) with μm-level dimple depth output, OK/NG by threshold, data to MES/SPC.
Field-proven
Installed and validated at multiple IC substrate / HDI / package substrate customers, several units in production.
(Customer names and unit counts are not disclosed by commercial agreement.)
Specifications (S9 / S9C single-machine reference)
| Board thickness | 1 – 300 mil | Max inspection area | 30" × 27.5" (762 × 698 mm) |
| Camera | 16K high-speed colour line scan | Light source | Controllable LED groups, bright/dark field |
| Data formats | Gerber RS274X / ODB++ (one-click auto CAM) | Stage | Zone vacuum clamping |
| Options | Computing power upgrade / manual & AI point screening / offline review / 3D depth | ||